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Miniaturisation: the no.1 challenge for laptop designers >

The cooling system

Vincent Alzieu
Updated: July 9, 2010
Back to the drawing board here. Every element was reviewed. One of the reasons for the height of the body of the computer is down to the fan that is placed on the processor, which itself is on the motherboard. This pile had to be reduced.

The solution found uses a new design for the shape of the fins on the fan. The new design is both much more complex and much more efficient, to the point where the fan's height could be considerably reduced.


An international tender was put out. A Japanese manufacturer, Toshiba if we're to believe the glimpse we caught on a label, answered it. Apparently Toshiba alone, at least at that time, was able to reduce the size of the fan and supply it within Sony's time constraints.


On the left, at the front, on the N-1 series. On the right: the new Vaio X.

The same problem on the Vaio Z

And here's an even more evolved, more efficient cooling system for the highest-end series, the Vaio Z (tested and given a 5-star rating). Note the use of copper that conducts heat better.


The future: more copper for more efficiency

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