Motherboard on a diet

On the previous series, the motherboard was dual-layer. One layer of components above and one beneath. Getting rid of the lower layer reduces thickness, but poses two problems: twice as many components must be fitted onto the surface area of the top layer and this adds terrible constraints to the card, which may break as a result.


Placing components on the lower layer meant it was easier to balance pressure points and produce a truly flat card more easily. By moving everything to the other side, the card becomes much more fragile.

Each positioning of components, necessitating two holes in the card, is studied. Stress points are defined, adjusted, moved, so that a balance can be found.


On this photo, the red wires begin at the pressure points. Eventually, a balance was found.

Next comes the problem of connectors, once again with the aim of reducing the machine's thickness.